工藝整合工程師

職位描述:


Responsibilities:


Lead the activities of designing and defining new MEMS process flows and integration scheme to meet product and manufacturing requirements. Assess the manufacturability of new process modules and process flows. 主導設計和定義新的MEMS流程和整合方案,以滿足產品和制造要求;評估新工藝模塊和流程的規模化生產可行性。


Coordinate and drive process module development in such areas as wafer bonding (eutectic and fusion), thin-film deposition, dry etch (include DRIE) and wet/dry clean processes.協調并推動工藝模塊的開發,例如硅片鍵合(eutectic bonding和fusion bonding),薄膜沉積,干法刻蝕(包括DIRE)以及干/濕法清洗工藝。


Drive the ramp and scale-up of new micro fabrication processes from prototype to high volume manufacturing in our state of the art MEMS fabrication facility. Support the specification, evaluation and qualification of process transfer to mass production.在我們先進的MEMS晶圓廠里,致力于推動新的生產工藝流程從原型到規模量產的整個過程。參與應用于量產階段的規范制定、評估和認證等工作。


Perform daily analysis of data from production and engineering process runs, qualifying changes or additions to manufacturing tool sets and process flows, and designing and executing engineering experiments to either resolve process excursions or to drive process performance improvements. 對于生產和工程試驗的產品,進行日常的數據分析;認證機臺設置、工藝流程的改變;設計并執行工程試驗以解決工藝問題或者改進工藝性能。


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